Over 10 Leading Experts Gather! The Agenda for the 2024 Advanced Packaging Key Technologies and Component Reliability Development Forum Revealed in Advance!
As the semiconductor industry faces the dual challenges of Moore's Law slowing down and rising manufacturing costs, advanced packaging materials technology is emerging as a key driving force for the industry's progress. By adopting high-performance packaging materials, system reliability and durability are effectively enhanced, breaking the limitations of traditional single-chip performance improvements. The rapid growth in sectors such as smartphones, tablets, automotive electronics, communication devices, sensors, and the Internet of Things (IoT) has made innovation and application of packaging materials and processes especially critical.
NEPCON ASIA 2024, a professional exhibition for the electronics manufacturing industry, will host the Advanced Packaging Key Technologies and Component Reliability Development Forum on November 6 at the Shenzhen International Convention and Exhibition Center (Bao'an). This forum will delve into multiple hot topics in the field of microelectronics packaging and assembly, including failure analysis techniques, common issues and solutions in micro-assembly processes, residual stress analysis, electromagnetic effect management, evaluation of advanced packaging materials, research on interconnect solder joint lifespan, conformal coating process reliability, as well as reflections on process value and case studies. Experts and scholars from institutions such as the Institute of Components and Materials at the Fifth Electronics Research Institute of the Ministry of Industry and Information Technology, the China Materials and Testing Group Standards Committee, Wuchuang Institute, and the U.S. Pacrim Technologies are expected to attend and share insights. They will jointly explore and promote innovation and application in packaging materials and processes, helping enterprises address market challenges and demands.
Agenda
Time |
Topic |
Speaker |
Affiliation |
10:30-11:00 |
Product Process Value Thinking and Typical Cases |
Fu Hongzhi |
Huaqin Group |
11:00-11:20 |
Component Process Adaptability Failure Mechanism and Evaluation Technology |
Zhou Zhou |
China Electronics Standardization Institute |
11:20-11:40 |
Common Issues and Solutions for Electromagnetic Effects in Components and Electronic Assemblies |
Shao Weiheng |
Key Laboratory of Electronic Component Reliability Physics and Its Application Technology |
11:40-12:00 |
Research on Failure Mechanism of Three-proof Coating for DFN Packaged Devices |
Huang Xiangbin |
ZTE Corporation |
14:00-14:20 |
Advanced Packaging Solutions for Advanced Node Chips |
Ge Weihu |
Founder and President, Pacrim Technologies, USA |
14:20-14:40 |
Development of Failure Analysis Technologies in Advanced Packaging |
Li Chao |
Researcher, Electronic Fifth Research Institute |
14:40-15:00 |
Residual Stress Analysis of Advanced Packaging Structures and Related Reliability Studies |
Wang Shizhao |
Vice President, Wu Chuang Institute for Chip Manufacturing and Design |
15:00-15:20 |
Failure Mechanism and Evaluation Technology Research of TIM Materials in Advanced Packaging |
Zhang Yingjie |
Project Director, China New Material Evaluation Platform - Electronic Materials Industry Center |
15:20-15:40 |
Common Issues and Guarantee Technologies in Micro-assembly Processes |
Liang Zihao |
Member, China Materials and Testing Group Standards Committee |
15:40-16:00 |
Advanced Substrate Solutions by Yueya Semiconductor |
Huang Benxia |
Director of Product Platform R&D Department, Yueya Semiconductor Co., Ltd. |
(Please note that the agenda is subject to change based on the actual situation at the meeting)