The ICPF semiconductor packaging Fair brings together many domestic packaging and testing factories, IDM brands with packaging and testing processes, and leading electronics manufacturing service providers. It focuses on the packaging and testing processes of core products like semiconductor ICs, power devices, optoelectronic devices, and sensors. The show comprehensively displays advanced equipment and materials for the entire semiconductor packaging and testing process, offering one-stop solutions. By precisely connecting upstream and downstream resources, it helps exhibitors efficiently develop new customers, explore new business areas, and promotes in-depth cooperation in the packaging and testing industry.
IC Packaging Fair
About ICPF 2025
Scale of Exhibition:
Key Buyers:
Exhibitor Profile：
01 Core Equipment for Integrated Circuits & Advanced Packaging & Testing :
Die bonder, chip bonder, glass bonding machine, flip chip bonder, wire bonder, molding machine, etching machine, optical cutting machine, lithography machine, vacuum coating machine, PVD sputtering machine, etc.
02 Core Equipment for Power Semiconductor Packaging & Testing:
Die bonder, chip bonder, methane flow furnace, sintering furnace, wire bonder, wedge bonder, dispensing equipment, molding machine, ball bonder, ultrasonic scanner, etc.
03 Core Equipment for Optoelectronic Semiconductor Packaging & Testing:
Die bonder, chip bonder, ball bonder, underfill dispense machine, automatic capping machine, LD chip high - low temperature tester, TO testing equipment, COC testing equipment, etc.
04 Peripheral & Testing Equipment & Materials:
Wafer thinning machine, die bonder, AOI inspection equipment, functional tester, electroplating equipment, ball bonder, underfill dispense machine, wire bonder, push - pull tester, silver paste, heat - sink, ceramic substrate, aluminum wire/copper wire/gold wire, etching solution, cleaning agent, photoresist, etc.
Show Highlights:
- Equipment & Materials Showcase
- International Semiconductor Packaging Technology Forum
- Semiconductor Packaging & Testing Process Demonstration
- Monthly & Thematic Business Matching Sessions
【Semiconductor Packaging and Testing Processes Demonstration Zone】
- uIntegrated Circuits & Advanced Packaging Workshop Display
- uIGBT & SiC Module Packaging Demonstration Line
- u800G/1.6T Optical Module Packaging Demonstration Line
ICPF Semiconductor Technology and Innovation Conference 2025
- SiP and Advanced Semiconductor Packaging Technology Conference
- Power Semiconductor Technology and Applications Conference
- Optoelectronic Devices Packaging and Testing Technology Conference
Target Audience:
- OSAT (Engineering and Manufacturing Departments)
- IDM In - house Packaging Workshop (Engineering and Manufacturing Departments)
- IDM (R&D\ Design Departments)