First Grand Debut! Power Semiconductor Packaging and Testing Process Demonstration Zone Explores Cutting-Edge "Chip" Manufacturing, Leading a New Era in Power Semiconductors

Introduction

In today’s rapidly evolving technological era, China’s power semiconductor market is growing at an unprecedented rate. According to authoritative forecasts from the China Business Industry Research Institute, the market size is expected to exceed 175.255 billion RMB by 2024, showing immense growth potential. As electronic products continue to trend towards miniaturization and integration, and with the rapid development of sectors such as automotive electronics, new energy, and smart grids, power semiconductor devices, as core components, are facing unprecedented application challenges and market demands.

To address these challenges and ensure that power semiconductor devices can continue to operate stably and efficiently in extreme working environments such as high voltage and high current, packaging and testing technology has become a key factor. The selection of packaging materials, process optimization, and equipment advancement directly affect product performance, reliability, and market competitiveness. Based on this deep understanding, the organizers of the IC Packaging Fair Semiconductor Packaging Technology Exhibition have meticulously prepared and newly launched the "Power Semiconductor Packaging and Testing Process Demonstration Zone."

Cutting-Edge Technology, Live Demonstrations

This demonstration zone focuses on two cutting-edge fields: IGBT and SiC module packaging and testing process lines.

Brand Collection, Efficient Product Discovery

It is expected to gather over 60 leading brands of semiconductor packaging and testing equipment and materials, from raw materials to finished product testing equipment.

Interactive Exchanges, Exploring Innovative Inspiration

Through on-site observation and interaction, this zone provides companies in power semiconductor packaging and testing with close opportunities to learn advanced technologies and draw innovative inspiration.

Three Core Process Stages

（SiC Die Attach Silver Sintering Process Stage）

（IGBT Solder Die Attach Process Stage）

（Wire Bonding and Encapsulation/Deflashing Process Stage）

Exhibition Range of IC Packaging Fair

The IC Packaging Fair Semiconductor Packaging Technology Exhibition comprehensively showcases new technologies, new equipment, and new solutions in semiconductor packaging and testing technology.

Some Exhibitors

Concurrent Activities

2024 7th ICPF Semiconductor Technology and Application Innovation Conference

Forum 1: Power Semiconductor Technology and Application

Date: November 6, 2024

Theme: The Status, Application, and Development Prospects of Power Semiconductors

Partner: Semiconductor Industry Watch

Forum 2: SiP and Advanced Semiconductor Packaging and Testing Technology

Date: November 7, 2024

Theme: Focus on Advanced Semiconductor Packaging Processes: From SiP to Chiplet

Partner: Semiconductor Industry Watch

1st International Glass Through-Via Technology Innovation and Application Forum

Date: November 6, 2024

Theme: Focus on Global Current and Future Technology Trends of TGV, Addressing Industry Challenges, and Fostering an Innovative Ecosystem to Promote TGV Industrialization

Organizer: CCPIT (China Council for the Promotion of International Trade)

Advanced Packaging Key Technologies and High-Reliability Development Forum

Date: November 6, 2024

Introduction: In-depth discussions on multiple hot topics in microelectronics packaging and assembly, including failure analysis technology, common issues and solutions in micro-assembly processes, residual stress analysis, electromagnetic effect management, evaluation of advanced packaging materials, interconnect solder joint lifespan research, conformal coating process reliability, and reflections on product process value with case studies.