Power Semiconductor Technology and Applications Forum | Collaborating with Industry Leaders Like Silan Microelectronics, Basic Semiconductor, Panasonic to Explore Breakthroughs and Prospects of New Materials and Devices like IGBT and SiC
NEPCON ASIA 2024 will host the 7th ICPF Semiconductor Technology and Application Innovation Conference on November 6 at the Shenzhen International Convention and Exhibition Center (Bao'an). Themed around power semiconductor technology and applications, this forum will bring together industry elites and top scholars to deeply explore the future development, technological innovations, and application prospects of power semiconductors.
The forum will focus on key sectors like electric vehicles, consumer electronics, high-performance computing, advanced communications, and renewable energy, sharing breakthrough achievements in new materials and devices such as IGBT and SiC/GaN. It will also highlight how these technologies can empower green energy transitions and drive intelligent manufacturing upgrades. Through multi-dimensional exchanges, the forum will promote the integration of industry, academia, and research, collaboratively mapping out the future development of power semiconductor technology, and leading the industry toward a more intelligent, green, and sustainable era.
Agenda
Time |
Event |
10:00-10:05 |
Opening Remarks |
10:05-10:30 |
Topic TBA - Hangzhou Silan Microelectronics Co., Ltd. |
10:30-10:55 |
Topic TBA - Shenzhen Basic Semiconductor Co., Ltd. |
10:55-11:20 |
Ultrasonic Welding in SiC Module Packaging Technology Applications - Panasonic Electric Works (China) Co., Ltd. |
11:20-11:45 |
Light Optoelectronic AI+3D Technology Assisting Semiconductor Packaging Visual Inspection - Yin Xiquan, SEMI Business & Marketing Director, Jiaxing Light Optoelectronic Technology Co., Ltd. |
11:45-12:05 |
Exploring the Infinite Potential of Super Junction IGBTs in High-Efficiency Energy Applications - Star Semiconductor / Jie Jie Microelectronics |
12:05-13:30 |
Lunch Break |
13:30-13:55 |
Automotive-Grade Power Devices - The Key Support for Automotive Innovation - CRRC / BYD |
13:55-14:20 |
Innovative Applications and Breakthroughs of SiC MOS in New Energy Vehicles - Hunan Sanan / PineTech / Yangjie Electronics |
14:20-14:45 |
Core SiC Packaging Technology - Silver Sintering Mass Production Solution - Ji Qinfeng, Senior Product Director - Jiangsu Kuaike Core Equipment Technology Co., Ltd. |
14:45-15:05 |
Elante Technology: 3D-CT Inspection Pioneer, Aiding Precise Advancement in Power Semiconductors - Tan Rongrong, Product Manager - Shenzhen Elante Technology Co., Ltd. |
15:05-15:30 |
SiC Mass Production: The New Engine for Onboarding Vehicles - Nexperia / Jingneng Microelectronics |
15:30-15:55 |
New Power for Industrial Upgrades: Unique Advantages of Gallium Nitride Solutions - Innoscience / Navitas Semiconductor / Xinyue Energy |
15:55-16:20 |
Industry Dialogue |
Look back on the scene
