Agenda | ITGV 2024 International Glass Through-Via Technology Innovation and Application Forum to be held on November 6 at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall)
Focusing on current and future trends in the global TGV technology industry, the forum aims to address current hot topics, solve industry challenges, foster an innovative ecosystem, and promote the industrialization of TGV. The 1st International Glass Through-Via Technology Innovation and Application Forum (ITGV 2024), hosted by the Electronic Information Industry Branch of the China Council for the Promotion of International Trade (CCPIT) and Future Semiconductors, will be held on November 6, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an New Hall). We sincerely invite colleagues from companies involved in glass through-vias, glass substrates, advanced packaging, and application markets to participate, transform new technologies, break through supply chains, and co-create new industries. The event schedule is as follows:
ITGV2024 Forum Schedule
Organizers: Electronic Information Industry Branch of the China Council for the Promotion of International Trade (CCPIT), Future Semiconductors, Beijing Hengren Zhixin Consulting Co., Ltd.
Media Partners: Electronic Industrial Equipment, Future Semiconductors
Date: November 6, 2024, 9:30 AM – 5:30 PM
Location: Shenzhen World Exhibition & Convention Center (Bao’an New Hall), Hall 9
Audience Size: 300
Topics
Glass Through-Via (TGV) and Advanced Packaging:
2.5D/3D TGV, Chiplet, Fan-Out Panel Level Packaging (FOPLP), Fan-Out Wafer Level Packaging (FOWLP), heterogeneous integration, glass interposer, glass transition boards, RDL, System-in-Package (SiP).
Design Solutions for Glass Through-Via:
EDA, glass substrate design, glass through-via fabrication methods, glass through-via structure and application, and vertical interconnect design, as well as detection and testing solutions, optical/electrical performance/mechanical testing.
Glass Through-Via and Interconnect Integration (Materials + Equipment):
Laser induction, high aspect ratio etching, sputtering, via filling and metallization, interconnect, CMP planarization, bonding, cutting, de-bubbling, and cleaning solutions.
Glass Substrates:
Glass materials, PI, ABF, and other innovative integration solutions.
Application of Glass Core Substrates in Emerging Markets:
Applications in wafer-level/panel-level packaging, Mini/Micro LED display, co-packaged optics (CPO), MIP packaging, 2.5D/3D packaging, MEMS sensors, RF chips, and optical communications.
Innovative Applications of TGV Technology in Future Artificial Intelligence (AI).
Speeches and Organizations
Application Value and Technical Challenges of Glass Substrates – Huawei HiSilicon
Trends and Future of Glass Core Technology – Georgia Institute of Technology, USA
Advanced Packaging Solutions for Glass Substrates – Pacrim Technology, USA
Glass Substrate – The Next Generation Passive Interconnect Material – Mori Electronics
Glass Through-Via Structure Control, Electromagnetic Properties, and Applications – Triassic (Guangdong) Technology Co., Ltd.
Glass-Based Interconnect Technology Supporting Advanced Packaging Industry Upgrades – BOE Sensor Technology Co., Ltd.
Laser-Induced Etching Technology for Glass Substrate-Level Packaging – LPKF, Germany
Laser Drilling Solutions for Advanced Glass Substrate Packaging – Samsung Electronics
Electroplating Solutions for Glass Substrate-Level Packaging – Atotech (MKS), USA
Glass Deposition Technology Applications for Fan-Out Large Panel-Level Packaging – Evatec, Switzerland
Laser Glass Through-Via Technology Driving TGV Industrialization – DILASER
Panel Level Laser-Induced Etching Comprehensive Solutions – Guihua Intelligent
TGV Advanced Packaging Design and EDA Solutions for Chiplet High-Performance Computing Systems – Chipsem
Multiphysics Simulation Technology Applications in Advanced Glass Substrate Packaging – YueMo Advanced
Large Panel Fan-Out Packaging Glass-Based FCGBA Substrate – Fosun Zhixin
Innovative AI Cases with SCHOTT Specialty Glass – SCHOTT
Innovative Applications of TGV Technology in Future AI – AI Design Company
Innovations in FOPLP – Leading OSAT company
Mystery Leading Company
Feedback Channel:
The final agenda and speaker list will be adjusted in the near future and on the day of the conference. If you are interested in participating in ITGV 2024 as a speaker or exhibitor, or in sponsoring, advertising, submitting articles, or conducting interviews, or if you have leading technology or product solutions, please send them to [email protected], or add Qi Daozhang on WeChat: xinguang1314.
