Exciting Agenda Revealed! Join experts and industry leaders from ZTE, Indium Corporation, MacDermid Alpha, Shunda Computer, and Shanghai Kaisun to explore new paths for the development of electronic manufacturing.
SMTA China South Technology Conference (Charged)
The SMTA South China High-Tech Technology Seminar will take place on November 6-7, 2024 at the Shenzhen International Convention and Exhibition Center (Bao'an). This seminar will bring together numerous industry experts and leaders to discuss key topics such as high-reliability soldering challenges, advances in conformal coating technologies, the impact of PCB solder mask materials on solder joint quality, low-temperature lead-free solder technologies, the iNEMI 2023 CPU socket technology roadmap, fan-out packaging, chipsets, and heterogeneous integration packaging. The event aims to provide a platform for professionals in the electronics industry to exchange insights on new technology trends, challenges, and solutions, thereby driving innovation and industry growth.
November 6-7 Shenzhen World Exhibition & Convention Center (Bao'an)
Agenda (11.6)
Topic |
Speaker |
Affiliation and Position |
|
10:30 - 11:05 |
High Reliability: Challenges of Soldering in Extreme Conditions |
Jiang Tao |
AIM Solder |
11:05 - 11:40 |
Conformal Coatings: Industry Status and Technological Frontiers |
Gao Zheng |
Chemetall, China Area Technology Manager |
11:40 - 12:15 |
Study on the Impact of PCB Solder Resist Materials on Solder Joint Quality |
Zhao Li |
ZTE Corporation, Process Expert and Project Manager |
13:45 - 14:20 |
Reliability of Low-Temperature Lead-Free Solder for Plastic Encapsulated Module Soldering |
Hu Jiejie |
Yintai Corporation, Senior Technical Manager for East China |
14:20 - 14:55 |
iNEMI 2023 Circuit Board Assembly - CPU Socket Technology 10-Year Roadmap |
Feng Guoxiao |
Shunda Computer Factory (Shunde) Co., Ltd., New Product Part Engineering Manager |
14:55 - 15:30 |
Fan-Out Packaging, Chipsets, and Heterogeneous Integration Packaging |
Dr. Liu |
Unimicron Technology Corporation |
Agenda (11.7)
Time |
Topic |
Speaker |
Affiliation and Position |
10:30 - 11:05 |
A New Type of No-Clean SAC305 Solder Paste for Air Reflow |
Bai Jinjin |
Alutech Company, Assistant Manager of R&D Department |
11:05 - 11:40 |
Dendritic Growth Dynamics: Exploring the Impact of Cleanliness under High Pressure |
Gao Wei |
Shanghai Kaisheng Clean Materials Co., Ltd., Sales Manager |
11:40 - 12:15 |
Reinforcement Technology for Electronic Solder Joints |
Nie Fugang |
ZTE Corporation, Chief Engineer of Assembly Process Technology Development Department, Member of China SMTA Technical Advisory Committee |
13:45 - 14:20 |
Can Assembly Materials Help You Achieve Sustainable Development Goals? |
Zhong Yici |
Product Manager, Chemetall Aifa |
14:20 - 14:55 |
Research on Flux Removal from Copper Pillar Bumps on Flip Chips |
Vern Solberg |
ZESTRON North Asia |
14:55 - 15:30 |
Innovative Solutions for 2D, 2.5D, and 3D Packaging |
Vern Solberg |
SMTA China South |
(The detailed agenda is subject to the speeches at the conference site, and the interpretation rights belong to the organizing unit.)
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Peggy Chen
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