2025.10.28-30
Shenzhen World Exhibition & Convention Center (Baoan)

MINI LED package

Focusing on MINI LED design companies and backlight module factories, combined with existing resources, namely, electronic manufacturing service providers OEM/EMS, ODM, electronic brand original OBM, focusing on the MINI LED backlight module COB process in all aspects of equipment, materials, automated production, and packaging services; the exhibition area will attract from backlight module factories, panels, terminal display products, semiconductors, 5G IoT, wireless communication, automotive electronics, medical electronics, computer, military electronics, and other industry core buyers.

Demonstration

MINI LED backlight module COB process line

Conference

Mini LED Chip and Packaging Solutions Forum:

1. Expected scale: 500 people+

2. Attendee group

Backlight module factory

IC design

EMS factories exploring the MINI LED packaging process

Panel factories exploring the MINI LED packaging process

3C, automotive electronics, medical electronics, Internet of Things, communication systems, and other terminal enterprises

Semiconductor software, equipment, and material companies

To learn about MINI LED packaging, please contact:

For exhibition/conference sponsorship, please contact:

Ms. Gu Bingrong

Tel: +86 21 22317010

Email: [email protected]

For visits, please contact:

Ms. Sun Mei

Tel: 400 650 5611

E-mail: [email protected]